Composite Engineering Show 2013 - NEC Birmingham

Come and see us on the 12th-13th November at the NEC, Birmingham UK

We're on Stand F121, we'd love to see you there



Surface Coatings & Release Agents | Adhesives

Within this product range we offer adhesives which can be applied in a variety of bonding applications.


A rapid setting, low viscosity, epoxy system designed for use when the bond line thickness is critical. This product is available in a range of different colours.


BB570 is a low density adhesive that has been designed for use where a matched CTE is required when using BB978 or BB769 Tooling Boards. The past application, gives a long open time, ideal for large blocking requirements.


A rapid setting toughened epoxy system. Designed for use where thermal and/or mechanical cycling is likely to occur. Its mixed viscosity allows for very thin bond lines.


Designed for use in very high temperature applications, giving excellent impact performance. BB950 is non-thixotropic, giving very thin bond lines.

matched adhesives

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